1/4 rev. b structure silicon monolit hic integrated circuit product series 2-phase half-wave pre driver for fan motor type ? features built - in zenner diode for vcc clamp absolute maximum ratings parameter symbol limit unit power dissipation pd 780 mw operating temperature topr -35 +95 storage temperature ts t g - 5 5 +150 output current iomax 40 ma al signal output current ial 15 ma al signal output voltage val 60 v junction temperature tjmax 150 to use at temperature above ta=25 reduce 6.24mw/ . (on 70.0mm 70.0mm 1.6mm glass epoxy board) operating conditions parameter symbol limit unit operating supply voltage range vcc 3.5 vcz v operating supply current range icc 1 30 ma fg output voltage range al output voltage range vsi 0 48 v hall input voltage range vh 0 vcz-1.5 v this product is not designed for pr oduction against radi oactive rays. this document may be strategic dat a subject to cocom regulations.
2/4 rev. b electrical characteristics (unl ess otherwise specified ta=25 ,vcc=5v) parameter symbol limit unit conditions min. typ. max. internal voltage vcz 5.5 6.0 6.5 v icc=10ma circuit current1 icc1 0.5 1.5 3.0 ma circuit current2 icc2 4 6.7 9.5 ma hall input hyster esis voltage vhys 5 15 25 mv lock detection on time ton 0.25 0.5 1 sec lock detection off time toff 2.5 5 10 sec output h voltage voh vcc-0.5 vcc-0.2 vcc v io=-10ma output l voltage vol - 0.2 0.5 v io=10ma hall output l voltage vfgl - 0.15 0.5 v ifg=5ma hall output leak current ifgl - 0 10 a vfg=48v alarm output l voltage vall - 0.15 0.5 v ial=5ma alarm output leak current iall - 0 10 a val=48v h+:3v,h-:2v,output,fg,al terminal are open. hall-input is 100hz square wave.output is connected with 1k to ground. fg and al are connected with 50k to vcc.
3/4 rev. b package outlines block diagram te r m i n a l n a m e pin no. terminal name 1 vcc 2 h+ 3 al 4 h- 5 gnd 6 fg 7 out1 8 out2 0.3min. 0.15 0.1 0.4 0.1 0.11 6.2 0.3 4.4 0.2 5.0 0.2 85 4 1 1.27 1.5 0.1 0.1 6712a lot no. sop 8(unit:mm) 1 2 3 4 8 7 6 5 tsd reg hall amp + - lock detection and auto restart control vcc h+ al h- out2 out1 fg gnd
4/4 rev. b cautions 1) absolute maximum ratings there is possibility of destruction in using beyond the absolute maximum rating. in case of destruction, a failure mode can not be defined (short mode or open mode). therefore when special mode is envisaged where absolute maximum rating may be ex ceeded, please take a physical safety measure such as fuse. 2) reverse connection of power supply connector reverse connection of power supply connector may break ic. take a measure against reverse connection destruction such as inserting a diode between power supply and vcc terminal. 3) power supply line back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor between power supply and gnd for routing regenerated current, and fully ensure that the capacitor char acteristics have no problem before determine a capacitor value 4) gnd potential ensure that the potential of gnd terminal is the minimum potential in any operating condition. also ensure that all terminals except gnd terminal do not fall below gnd voltage including transient characteristics. however, it is possible that the motor output termi nal may deflect below gnd because of influence by back electromotive force of moto r. malfunction may possibly occur depending on use condition, environment, and property of individual motor. please make fully confirmation that no problem is found on operation of ic. 5) thermal design consider the power dissipation under actual use condition and apply thermal design with sufficient margin. 6) mounting failures in attaching ic to printed board, pay enough attent ion to the direction and dislocation of ic. mounting failures may break ic. in addition, destruction is also possible when circuit is shorted by foreign substance brought between outputs or be tween output and power supply - gnd. 7) operation in strong electromagnetic field use in strong electromagnetic field ma y cause malfunction, please be careful. 8) aso please consider that the output tr does not exceed the absolute maximum rating and aso. 9) thermal shut down circuit this ic has thermal shut down (tsd) circuit. operation temperature is 175 (typ.) and has a hysteresis width of 25 (typ.). when ic chip temperature rises and tsd circuit works, the output terminal becomes an open state. tsd circuit is simply for the purpose of intercepting ic from overheating, and not for protecting and assuring ic. therefore do not c ontinue to use ic thereafter with this circuit operating and do not use ic assuming the operation of this circuit. 10) inspection with a set board when connecting a capacitor to a pin with low impedance in inspection on a set board, stress may possibly be applied to ic, therefore be sure to apply discharging in each process. in attaching to and detaching from jigs in inspection process, be sure to turn off power before connecting, and turn off power before removing ic. in addition, apply grounding to assembling process as a measure of anti-static electricity, and use full caution in transporting and storing. 11) gnd wiring pattern when there are small signal gnd and large current gn d, separate the large current gnd pattern from small signal gnd pattern. it is recommended to apply one-point grounding at the reference point of the set in order that resistance of wiring pattern and large current do not cause change of voltage of small signal gnd. please be cautious not to fluctuate the wiring pattern of gnd of external mounted parts. 12) capacitor between output and gnd when a large capacitor is connected between output and gnd, if vcc is shorted with 0v or gnd for some cause, it is possible that the current charged in the capacitor may flow into the output resulting in destruction. keep the capacitor between output and gnd below 100uf. 13) ic terminal input when vcc voltage is not applied to ic, do not apply voltage to each input terminal. when voltage above vcc or below gnd is applied to the input terminal, pa rasitic element is actuated due to the structure of ic. operation of parasitic element causes mutual in terference between circuits, resulting in malfunction as well as destruction in the last. do not use in a manner where parasitic element is actuated.
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